Effect of Cold Plasma Voltage and Treatment Duration on the Microstructure and Hydrophilicity of Mushroom Grain Spawn

DOI HANDLE オープンアクセス
  • Fong Mun Oon
    School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
  • Agun Linda
    School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
  • Mohd Fadthul Ikmal Misnal
    School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
  • Muhamad Nor Firdaus Zainal
    School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
  • Redzuan Norizah
    School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
  • Norhayati Binti Ahmad
    School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia

抄録

Nowadays, cold plasma treatment systems are widely used in many fields such as agriculture. It was proven that this technique can improve growth rate of mushroom grain spawn, but no research had been done on spawn treatment using cold plasma. Cold plasma surface treatment system was developed by using voltages of 2kV to 4 kV and treatment durations of 5s to 60 s were used. The results show an improvement of grain spawn hydrophilic properties and growth rate. The most suitable parameters to treat mushroom grain spawn were 2.5kV of voltage with treatment time of 15s resulting in increasing growth of mushroom until 5.7cm.

収録刊行物

  • Evergreen

    Evergreen 11 (1), 379-385, 2024-03

    九州大学グリーンテクノロジー研究教育センター

キーワード

詳細情報 詳細情報について

  • CRID
    1390862776827960576
  • DOI
    10.5109/7172300
  • ISSN
    24325953
    21890420
  • HANDLE
    2324/7172300
  • 本文言語コード
    en
  • データソース種別
    • JaLC
    • IRDB
    • Crossref
  • 抄録ライセンスフラグ
    使用可

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