Thermal Fluid Simulation Modeling Based on Thermal Transient Test and Fatigue Analysis of Asymmetric Structural Double-Sided Cooling Power Module

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  • Hara Tomoaki
    Siemens DI Software, Presales Division, Siemens K.K. Division of Electrical, Electronic, and Information Engineering, Osaka University
  • Aoki Yoshitaka
    Siemens DI Software, Presales Division, Siemens K.K.
  • Funaki Tsuyoshi
    Division of Electrical, Electronic, and Information Engineering, Osaka University

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  • 非対称構造を持つ両面放熱パワーモジュールの過渡熱測定に基づく熱流体シミュレーションモデリングと劣化解析
  • ヒタイショウ コウゾウ オ モツ リョウメン ホウネツ パワーモジュール ノ カト ネツ ソクテイ ニ モトズク ネツ リュウタイ シミュレーションモデリング ト レッカ カイセキ

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<p>Three-dimensional thermal fluid simulation is useful in research and development, improving the efficiency of power module thermal designs for front-loading development of power electronic systems. This paper reports on three-dimensional thermal fluid simulation modeling based on thermal transient measurement results and fatigue analysis for an structurally asymmetric, double-sided cooling, 2-in-1 power module with IGBT (Insulated Gate Bipolar Transistor) and FWD (Free Wheeling Diode). The model parameters are calibrated by structure functions extracted from measurement results of the IGBT embedded in the device under test. As an example of the fatigue analysis, solder delamination as a result of solder fatigue is evaluated using the calibrated model.</p>

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