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Thermal Fluid Simulation Modeling Based on Thermal Transient Test and Fatigue Analysis of Asymmetric Structural Double-Sided Cooling Power Module
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- Hara Tomoaki
- Siemens DI Software, Presales Division, Siemens K.K. Division of Electrical, Electronic, and Information Engineering, Osaka University
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- Aoki Yoshitaka
- Siemens DI Software, Presales Division, Siemens K.K.
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- Funaki Tsuyoshi
- Division of Electrical, Electronic, and Information Engineering, Osaka University
Bibliographic Information
- Other Title
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- 非対称構造を持つ両面放熱パワーモジュールの過渡熱測定に基づく熱流体シミュレーションモデリングと劣化解析
- ヒタイショウ コウゾウ オ モツ リョウメン ホウネツ パワーモジュール ノ カト ネツ ソクテイ ニ モトズク ネツ リュウタイ シミュレーションモデリング ト レッカ カイセキ
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Description
<p>Three-dimensional thermal fluid simulation is useful in research and development, improving the efficiency of power module thermal designs for front-loading development of power electronic systems. This paper reports on three-dimensional thermal fluid simulation modeling based on thermal transient measurement results and fatigue analysis for an structurally asymmetric, double-sided cooling, 2-in-1 power module with IGBT (Insulated Gate Bipolar Transistor) and FWD (Free Wheeling Diode). The model parameters are calibrated by structure functions extracted from measurement results of the IGBT embedded in the device under test. As an example of the fatigue analysis, solder delamination as a result of solder fatigue is evaluated using the calibrated model.</p>
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 24 (1), 130-142, 2021-01-01
The Japan Institute of Electronics Packaging
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Keywords
Details 詳細情報について
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- CRID
- 1391131406295191808
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- NII Article ID
- 130007965199
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 031257186
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
- CiNii Articles
- OpenAIRE
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- Abstract License Flag
- Disallowed