Effect of Post-Chemical-Mechanical Polishing Surface Treatments on the Interfacial Adhesion Energy between Cu and a Capping Layer
Bibliographic Information
- Other Title
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- Special Issue : Electronic Materials and Nanotechnology for Green Environment
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Journal
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- Japanese journal of applied physics : JJAP
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Japanese journal of applied physics : JJAP 52 (10), 2013-10
Tokyo : The Japan Society of Applied Physics
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Details 詳細情報について
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- CRID
- 1520290882515531520
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- NII Article ID
- 40019841294
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- NII Book ID
- AA12295836
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- ISSN
- 00214922
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- NDL BIB ID
- 024955138
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- Text Lang
- en
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- NDL Source Classification
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- ZM35(科学技術--物理学)
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- Data Source
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- NDL
- CiNii Articles
