A Simple Method for Separating Dissipation Factors in Microwave Printed Circuit Boards (Special Issue on Measurement Techniques for Microwave/Millimeter Wave)

Tanaka Hiroyuki, Okada Fumiaki

A simple method for separating the dissipation factors associated with both conductor losses and dielectric losses of printed circuit boards in microwave frequencies is presented. This method utilizes the difference in dependence of two dissipation factors on the dimensions of bounded stripline resonators using a single printed circuit board specimen as a center strip conductor. In this method, the separation is made through a procedure involving the comparison of the measured values of the total dissipation factor with those numerically calculated for the resonators. A method, which is based on a TEM wave approximation and uses Green's function and a variational principle, is used for the numerical calculation. Both effective conductivity for three kinds of industrial copper conductor supported with a substrate of polyimide film and dielectric loss tangent of the substrates are determined using this method from the values of the unloaded Q measured at the 10 GHz region. Radiation losses from the resonator affecting the accuracy of the separation are discussed, as well as the values of the effective conductivity of metals on the polyimide substrate which is calculated using the above method. The resulting values of the effective conductivity agree with those using the triplateline method within 10%.

A Simple Method for Separating Dissipation Factors in Microwave Printed Circuit Boards (Special Issue on Measurement Techniques for Microwave/Millimeter Wave)

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