New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
-
- FUKUSHIMA Takafumi
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
-
- YAMADA Yusuke
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
-
- KIKUCHI Hirokazu
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
-
- KOYANAGI Mitsumasa
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
この論文をさがす
収録刊行物
-
- Extended abstracts of the ... Conference on Solid State Devices and Materials
-
Extended abstracts of the ... Conference on Solid State Devices and Materials 2005 64-65, 2005-09-13
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1570572700671647872
-
- NII論文ID
- 10022540983
-
- NII書誌ID
- AA10777858
-
- 本文言語コード
- en
-
- データソース種別
-
- CiNii Articles