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Deep Trench Etching for Chip-to-Chip Three-Dimensional Integration
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- KIKUCHI Hirokazu
- Dept. of Bioengineering and Robotics, Tohoku Univ.
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- YAMADA Yusuke
- Dept. of Bioengineering and Robotics, Tohoku Univ.
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- KIJIMA Hitoshi
- Dept. of Bioengineering and Robotics, Tohoku Univ.
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- FUKUSHIMA Takafumi
- Dept. of Bioengineering and Robotics, Tohoku Univ.
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- KOYANAGI Mitsumasa
- Dept. of Bioengineering and Robotics, Tohoku Univ.
Search this article
Journal
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- Extended abstracts of the ... Conference on Solid State Devices and Materials
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Extended abstracts of the ... Conference on Solid State Devices and Materials 2005 562-563, 2005-09-13
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Details 詳細情報について
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- CRID
- 1570572700671998976
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- NII Article ID
- 10022542549
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- NII Book ID
- AA10777858
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- Text Lang
- en
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- Data Source
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- CiNii Articles
