Advantage of silver plating on PCB for CSP/BGA assembly : Improvement of connection reliability for special kind of silver plating on PCB.

Bibliographic Information

Other Title
  • 次世代CSP実装技術Agめっき基板の優位性 : 特殊無電解銀めっき基板による接続信頼性の向上

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Description

Now many assembly makers useing nickel/gold plating printed circuit board for BGA/CSP applications. But nickel/gold plating has poor performance for BGA/CSP assembly. And Historical disadvantages of silver plating were migration, unstable solutions and readily forms black sulphides. We developed and overcame this kind of problem by using immersion organo-metallic silver technology. The technology can replace nickel/gold plating for BGA/CSP applications.

Journal

  • Technical report of IEICE. DSP

    Technical report of IEICE. DSP 99 (486), 39-43, 1999-12-03

    The Institute of Electronics, Information and Communication Engineers

Keywords

Details 詳細情報について

  • CRID
    1570854177430828160
  • NII Article ID
    110003280705
  • NII Book ID
    AN10060786
  • ISSN
    09135685
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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