Investigation of Cu/low-k film delamination in flip chip packages
Journal
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- Proc. 56th Electronic Components and Technol. Conf., 2006
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Proc. 56th Electronic Components and Technol. Conf., 2006 709-717, 2006
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Details 詳細情報について
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- CRID
- 1571980075778927744
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- NII Article ID
- 10025889052
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- Data Source
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- CiNii Articles