Non-destructive extraction of width bias variations for deep sub-micron interconnect lines
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- TANG Mao-Chyuan
- Central R & D Division, United Microelectronics Corp.
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- WANG Meng-Feng
- Central R & D Division, United Microelectronics Corp.
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- CHENG Tim
- Central R & D Division, United Microelectronics Corp.
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- CHEN David
- Central R & D Division, United Microelectronics Corp.
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- YEH C S
- Central R & D Division, United Microelectronics Corp.
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- CHIEN S C
- Central R & D Division, United Microelectronics Corp.
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- Extended abstracts of the ... Conference on Solid State Devices and Materials
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Extended abstracts of the ... Conference on Solid State Devices and Materials 2007 398-399, 2007-09-19
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- CRID
- 1572261550532543360
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- NII論文ID
- 10022549255
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- NII書誌ID
- AA10777858
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- 本文言語コード
- en
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- データソース種別
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