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Microjoining Process in Electronic Packaging and Its Numerical Analysis

  • TAKAHASHI Yasuo
    JWRI, Osaka University
  • GANG Tie
    JWRI, Osaka University, National Key Laboratory of Advanced Welding Production Technology

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Abstract

The present study was carried out for the purpose of understanding interfacial deformation processes during solid state inner lead bonding, which is used in electronic packaging. At first, the representative microjoining processes are summarized by showing some photos and illustrations. After that, the interfacial deformation between the electric pad and the inner lead is analyzed, using numerical simulations. In particular, two effects of the bump thickness and the mechanical property on the interfacial extension are analyzed. The numerical simulations are carried out by using a finite element method (FEM), which can be applied for large deformation of rate sensitivity materials.

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Details

  • CRID
    1572824502138852480
  • NII Article ID
    110006486096
  • NII Book ID
    AA00867058
  • ISSN
    03874508
  • Text Lang
    en
  • Data Source
    • CiNii Articles

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