A Simple Evaluation Formula for Parallel Plate Mode Suppression by Via-hole Partition

2 References

Bibliographic Information

Other Title
  • VIAホール列による平行平板モード抑圧量の簡易評価式

Search this article

Description

Couplings by a parallel plate mode between terminals in a multi-layered RF package are a common problem that degrades circuit performance. Via-holes that short-circuit ground planes are used for suppressing this mode. Quantitative evaluation of relations between the amount of suppression and various parameters, such as the number of column, diameters and pitches of via-holes is required for optimal disposition of the via-holes. In this paper, a simple evaluation formula that describes the amount of the suppression is derived by mode-matching technique. The results of comparison with the finite element method validate our proposing formula.

Journal

References(2)*help

See more

Keywords

Details 詳細情報について

  • CRID
    1573105977259327232
  • NII Article ID
    110003175275
  • NII Book ID
    AN10012954
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

Report a problem

Back to top