Advanced Techniques to Decrease Defect Density in Molecular Beam Epitaxial Silicon Films
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- Tatsumi Toru
- Fundamental Research Laboratories, NEC Corporation
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- Aizaki Naoaki
- Fundamental Research Laboratories, NEC Corporation
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- Tsuya Hideki
- Fundamental Research Laboratories, NEC Corporation
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説明
Defect density dependence on various surface cleaning conditions for molecular beam epitaxial (MBE) silicon films was investigated. Defect-free films were obtained on (100) and (511) wafers, using a combination of ozone cleaning and predeposition process after the usual wet cleaning. On the (111) wafer, the defect density dependence on growth rate was examined. The two-step growth-rate procedure was effective in decreasing stacking faults on the (111) wafer. The difference in defect density between (100) and (111) wafers is also discussed.
収録刊行物
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 24 (4), L227-L229, 1985
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詳細情報 詳細情報について
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- CRID
- 1573387452127149056
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- NII論文ID
- 110003929759
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- NII書誌ID
- AA10650595
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- 本文言語コード
- en
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- データソース種別
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- CiNii Articles