High-Temperature Stability of Copper-Gate AlGaN/GaN High Electron Mobility Transistors
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- AO Jin-Ping
- Satellite Venture Business Laboratory, The University of Tokushima
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- KIKUTA Daigo
- Department of Electrical and Electronic Engineering, The University of Tokushima
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- KUBOTA Naotaka
- Department of Electrical and Electronic Engineering, The University of Tokushima
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- NAOI Yoshiki
- Department of Electrical and Electronic Engineering, The University of Tokushima
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- OHNO Yasuo
- Department of Electrical and Electronic Engineering, The University of Tokushima
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Description
High-temperature stability of copper (Cu) gate AlGaN/GaN high electron mobility transistors (HEMTs) was investigated. Samples were annealed at various temperatures to monitor the changes on device performances. Current-voltage performance such as drain-source current, transconductance, threshold voltage and gate leakage current has no obvious degradation up to annealing temperature of 500℃ and time of 5 minutes. Also up to this temperature, no copper diffusion was found at the Cu and AlGaN interface by secondary ion mass spectrometry determination. At annealing temperature of 700℃ and time of 5 minutes, device performance was found to have degraded. Gate voltage swing increased and threshold voltage shifted due to Cu diffusion into AlGaN. These results indicate that the Schottky contact and device performance of Cu-gate AlGaN/GaN HEMT is stable up to annealing temperature of 500℃. Cu is a promising candidate as gate metallization for high-performance power AlGaN/GaN HEMTs.
Journal
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- IEICE Trans. Electron., C
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IEICE Trans. Electron., C 86 (10), 2051-2057, 2003-10-01
The Institute of Electronics, Information and Communication Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1573950402232322944
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- NII Article ID
- 110003214506
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- NII Book ID
- AA10826283
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- ISSN
- 09168524
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- Text Lang
- en
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- Data Source
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- CiNii Articles