Carbon Contamination Free Wafer Cleaning
説明
It is difficult not only to detect a small volume of hydrocarbons on Si wafer surface but also to remove the organic impurities by conventional dipping cleaning. Therefore, new analysis method and new cleaning method are required in the semiconductor manufacturing. We have developed the advanced Dynamic-Spin Cleaning System with the ozonized ultrapure water. The experimental results demonstrate that this system is more effective than the conventional dipping cleaning. And then hydrocarbons were confirmed by FT-IR-ATR method. Generally, this method can not detect the very small volume of hydrocarbons. However, this problem is solved by using an ATR-prism made from other materials, like as germanium. Using other materials as ATR-prism can correct exact background spectrum. Therefore, a very small amount of organic impurities can be detected.
収録刊行物
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- International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM
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International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM 219-220, 2005-08-24
IEEE
