III–V/Si Chip-on-Wafer Direct Transfer Bonding technology (CoW DTB); process capabilities and bonded structure characterizations
説明
Three-Dimensional (3D) integration of group III–V compound semiconductor devices on silicon (III–V/Si) is important for next-generation microsystems such as Si photonics or ultra-high-frequency electronics. We proposed a new “Chip-on-Wafer Direct Transfer Bonding” (CoW DTB) technology for III–V/Si applications. The technology concept was demonstrated using newly developed equipment and bond evaluation of InP diced chips with AlGaInAs Multiple Quantum Well (MQW) epitaxial layers on 200 mm diameter Si wafer. This paper describes process applicability for small die, structure analysis and electrical characteristic of InP/Si oxide bond interface.
収録刊行物
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- 2016 6th Electronic System-Integration Technology Conference (ESTC)
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2016 6th Electronic System-Integration Technology Conference (ESTC) 1-6, 2016-09-01
IEEE
