Fabrication of optical MEMS switches having multilevel mirror-drive electrodes
説明
The aim of this work is to show the effective way for the formation of optical MEMS switches by applying seamless integration technology (SeaiT) as a first step toward LSI integration. The fabrication process of the optical MEMS switches in this work consisted of electrode fabrication, mirror fabrication, and packaging. A 6-inch-diameter bulk-Si and SOI wafers are used for the fabrication of electrodes and mirrors, respectively.
収録刊行物
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- 2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682)
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2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682) 121-122, 2004-06-03
IEEE
