Thermal studies of finned LSI packages under forced convection
説明
A description is given of extensive computer-based analytical and experimental studies on finned LSI packages, utilizing a cavity-down-type QFP (quad flat package) with 348 pins, in order to examine the simulation method for a high-thermal-performance package and its heat sink. The numerical analysis was accomplished for a conjugate problem, which encompassed flow and heat transfer in the cooling air stream and heat conduction in the package and the heat sink. Experiments were conducted to measure the temperature rise at the junction, the package surface, and the fin, using several kinds of omnidirectional heat sink fins in a wind tunnel. The applicability of the model used for the simulation and the computational scheme were verified by comparing the experimental results with those obtained on the basis of the model. The comparisons indicate that the proposed numerical method for obtaining the thermal resistance is satisfactory for thermal design. >
収録刊行物
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- Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium
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Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium 20-24, 1989-01-01
IEEE
