Ultra-shallow junction formed using laser annealing for sub-50 nm MOS devices

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Requirements for the shallow junction technology in the sub-50 nm regime have been discussed. We propose a new ultra-shallow junction formation method called as Laser Induced Atomic Layer Doping (LI-ALD). The ultra-shallow junction with the depth of less than 20 nm could be formed using LI-ALD. The NMOS transistors with the ultra shallow junction formed by LI-ALD were demonstrated in this paper.

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