[Updated on Apr. 18] Integration of CiNii Articles into CiNii Research

Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Bibliographic Information

Title
Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Author
Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi

Journal

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Details

  • CRID
    1010000782064225303
  • Article Type
    journal article
  • Data Source
    • KAKEN

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