Reflow behavior of Cu-Mn in LSI line patterns
書誌事項
- タイトル
- Reflow behavior of Cu-Mn in LSI line patterns
- 著者
- Tomohiro Saito, Daisuke Ando, Yuji Sutou, and Junichi Koike
収録刊行物
-
- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 53 2014