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Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
Bibliographic Information
- Title
- Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
- Author
- Akio Hirose
Journal
-
- Journal of the JRICu Vol.41-No.1
-
Journal of the JRICu Vol.41-No.1 293-298, 2002
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Details 詳細情報について
-
- CRID
- 1010282256756839452
-
- Article Type
- journal article
-
- Data Source
-
- KAKEN
