Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
書誌事項
- タイトル
- Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
- 著者
- Akio Hirose
収録刊行物
-
- Journal of the JRICu Vol.41-No.1
-
Journal of the JRICu Vol.41-No.1 293-298, 2002