[Updated on Apr. 18] Integration of CiNii Articles into CiNii Research

Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP

  • HIROSE Akio
    Osaka University, Graduate School of Engineering, Associate Professor

Bibliographic Information

Title
Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
Author
Akio Hirose

Journal

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Details

  • CRID
    1010282256756839452
  • Article Type
    journal article
  • Data Source
    • KAKEN

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