Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
Bibliographic Information
- Title
- Effects of Interfacial Reaction between Lead-Free Solders and Cu Pad on the Joint Strength of QFP
- Author
- Akio Hirose
Journal
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- Journal of the JRICu Vol.41-No.1
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Journal of the JRICu Vol.41-No.1 293-298, 2002
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Details 詳細情報について
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- CRID
- 1010282256756839452
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- Article Type
- journal article
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- Data Source
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- KAKEN