[Updated on Apr. 18] Integration of CiNii Articles into CiNii Research

Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits

Bibliographic Information

Title
Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits
Author
Melamed Samson、渡辺 直也、根本 俊介、菊地 克弥、青柳 昌宏

Journal

Citations (0)*help

See more

References(0)*help

See more

Related Articles

See more

Related Data

See more

Related Books

See more

Related Dissertations

See more

Related Projects

See more

Related Products

See more

Details

  • CRID
    1010282256772576896
  • Article Type
    journal article
  • Data Source
    • KAKEN

Report a problem

Back to top