Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits
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- 青柳 昌宏
- 国立研究開発法人産業技術総合研究所
Bibliographic Information
- Title
- Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits
- Author
- Melamed Samson、渡辺 直也、根本 俊介、菊地 克弥、青柳 昌宏
Journal
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- Proceedings of 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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Proceedings of 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - 2015
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Details 詳細情報について
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- CRID
- 1010282256772576896
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- Article Type
- journal article
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- Data Source
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- KAKEN
