Interfacial Dissolution Reaction and Thermal Fatigue Cycle Property for Sn-Ag-Al Solder Alloy/Cu
Bibliographic Information
- Other Title
-
- Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性
Abstract
We investigated interfacial dissolution reaction and thermal fatigue cycle properties for Sn-Ag-Al solder alloy/Cu. Sn-Ag-Al solder alloys showed better tensile and thermal fatigue property than Sn-3Ag-0.5Cu. The dissolution speed Cu into Sn-2Ag-0.1Al is higher than that into Sn-3Ag-0.5Cu. We guessed the difference of the morphology and the speed of crack propagation between Sn-2Ag-0.1Al and Sn-3Ag-0.5Cu was generated by changing microstructure of solder near reaction layer.
Journal
-
- 10th Symposium on Microjoining and Assembly Technology in Electronics
-
10th Symposium on Microjoining and Assembly Technology in Electronics 5-6 149-154, 2004-02
溶接学会（マイクロ接合研究委員会）