Sn-Ag-Al系合金/Cu接合による界面溶解反応と熱疲労サイクル特性
書誌事項
- タイトル別名
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- Interfacial Dissolution Reaction and Thermal Fatigue Cycle Property for Sn-Ag-Al Solder Alloy/Cu
説明
We investigated interfacial dissolution reaction and thermal fatigue cycle properties for Sn-Ag-Al solder alloy/Cu. Sn-Ag-Al solder alloys showed better tensile and thermal fatigue property than Sn-3Ag-0.5Cu. The dissolution speed Cu into Sn-2Ag-0.1Al is higher than that into Sn-3Ag-0.5Cu. We guessed the difference of the morphology and the speed of crack propagation between Sn-2Ag-0.1Al and Sn-3Ag-0.5Cu was generated by changing microstructure of solder near reaction layer.
収録刊行物
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- 10th Symposium on Microjoining and Assembly Technology in Electronics
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10th Symposium on Microjoining and Assembly Technology in Electronics 5-6 149-154, 2004-02
溶接学会(マイクロ接合研究委員会)