CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
書誌事項
- タイトル
- "CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas"
- 責任表示
- sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]
- 出版者
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- American Society of Mechanical Engineers
- 出版年月
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- c1997
- 書籍サイズ
- 28 cm
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注記
Includes bibliographical references and index
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詳細情報 詳細情報について
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- CRID
- 1130000794905536896
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- NII書誌ID
- BA44133264
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- ISBN
- 0791818527
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- LCCN
- 98166447
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- Web Site
- https://lccn.loc.gov/98166447
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- 本文言語コード
- en
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- 出版国コード
- us
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- タイトル言語コード
- en
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- 出版地
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- New York
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- 分類
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- LCC: TK7870.25
- DC21: 621.381/046
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- 件名
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- LCSH: Electronic apparatus and appliances -- Temperature control -- Congresses
- LCSH: Electronic packaging -- Design -- Data processing -- Congresses
- LCSH: Heat -- Transmission -- Data processing -- Congresses
- LCSH: Heat sinks (Electronics) -- Congresses
- LCSH: Computer-aided engineering -- Congresses
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- データソース種別
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- CiNii Books