Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

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タイトル: "Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California"

責任表示: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh

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タイトル別名

"Papers presented at the annual ASME Symposium on Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures"--Foreword

Includes bibliographical references and author index