Wide bandgap power semiconductor packaging : materials, components, and reliability

CiNii Available at 3 libraries

Bibliographic Information

Title
"Wide bandgap power semiconductor packaging : materials, components, and reliability"
Statement of Responsibility
edited by Katsuaki Suganuma
Publisher
  • Woodhead Publishing, an imprint of Elsevier
Publication Year
  • c2018
Book size
23 cm
Series Name / No
  • : print

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Notes

Includes bibliographical references and index

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Details 詳細情報について

  • CRID
    1130000795560549376
  • NII Book ID
    BB26392188
  • ISBN
    9780081020944
  • Text Lang
    en
  • Country Code
    uk
  • Title Language Code
    en
  • Place of Publication
    • Duxford
  • Classification
  • Subject
  • Data Source
    • CiNii Books
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