Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

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書誌事項

タイトル
"Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing"
責任表示
editors, S. Raghavan, R.L. Opila, L. Zhang ; Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
出版者
  • Electrochemical Society
出版年月
  • c1998
書籍サイズ
23 cm
タイトル別名
  • Chemical mechanical planarization in integrated circuit device manufacturing

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注記

"Electronics and Dielectric Science and Technology Divisions."

"This volume contains most of the papers presented at the Second International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit (IC) Device Manufacturing held at the 193rd Annual Meeting of Electrochemical Society in San Diego during May 5-7, 1998."

Includes bibliographical references and indexes

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