Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA

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Bibliographic Information

Title
"Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA"
Statement of Responsibility
Allyson L. Hartzell, Rajeshuni Ramesham, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Publisher
  • SPIE
Publication Year
  • c2007
Book size
28 cm
Other Title
  • Reliability, packaging, testing, and characterization of MEMS/MOEMS 6
  • Reliability, packaging, testing, and characterization of MEMS/MOEMS six

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Notes

Includes bibliographical references and author index

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