Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA

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Bibliographic Information

Title
"Reliability, packaging, testing, and characterization of MEMS/MOEMS IV : 24-25 January 2005, San Jose, California, USA"
Statement of Responsibility
Danelle M. Tanner, Rajeshuni Ramesham, chairs/editors ; sponsored ... by SPIE--the International Society for Optical Engineering ; cooperating organizations, SEMI--Semiconductor Equipment and materials International, Solid State Technology [and] Sandia National Laboratories (USA)
Publisher
  • SPIE
Publication Year
  • c2005
Book size
28 cm
Other Title
  • Reliability, testing and characterization of MEMS/MOEMS
  • Reliability, packaging, testing, and characterization of MEMS, MOEMS 4

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Notes

Previous conferences entitled: Reliability, testing, and characterization of MEMS/MOEMS

Includes bibliographical references and author index

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