Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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Bibliographic Information

Title
"Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas"
Statement of Responsibility
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read
Publisher
  • American Society of Mechanical Engineers
Publication Year
  • c1997
Book size
28 cm
Other Title
  • Fracture mechanics in electronic packaging

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Notes

"Papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii

Includes bibliographical references and index

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