Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

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タイトル: "Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas"

責任表示: sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. Read

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タイトル別名

"Papers that were presented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii

Includes bibliographical references and index