Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
収録刊行物
-
- 2017 IEEE International Electron Devices Meeting (IEDM)
-
2017 IEEE International Electron Devices Meeting (IEDM) 32.4.1-32.4.4, 2017-12
IEEE