RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

詳細情報 詳細情報について

• CRID

  1360855568857302912

• DOI

  10.1016/j.mee.2009.08.026

• ISSN

  01679317

• Web Site

  https://api.elsevier.com/content/article/PII:S0167931709005620?httpAccept=text/xml

  https://api.elsevier.com/content/article/PII:S0167931709005620?httpAccept=text/plain

• データソース種別

  • Crossref