Ultra thinning down to 4-µm using 300-mm wafer proven by 40-nm node 2Gb DRAM for 3D multi-stack WOW applications
収録刊行物
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- 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers
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2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers 2014-06
IEEE