Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
書誌事項
- 公開日
- 2009-05
- DOI
-
- 10.1109/ectc.2009.5074039
- 公開者
- IEEE
収録刊行物
-
- 2009 59th Electronic Components and Technology Conference
-
2009 59th Electronic Components and Technology Conference 350-354, 2009-05
IEEE
