The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications
書誌事項
- 公開日
- 2003-04
- 権利情報
-
- https://www.elsevier.com/tdm/userlicense/1.0/
- DOI
-
- 10.1016/s0026-2714(02)00348-7
- 公開者
- Elsevier BV
この論文をさがす
収録刊行物
-
- Microelectronics Reliability
-
Microelectronics Reliability 43 (4), 625-633, 2003-04
Elsevier BV
