Thermally Induced Failure of Copper‐Bonded Alumina Substrates for Electronic Packaging

DOI Web Site Web Site 被引用文献1件

書誌事項

公開日
1992-12
権利情報
  • http://onlinelibrary.wiley.com/termsAndConditions#vor
DOI
  • 10.1111/j.1151-2916.1992.tb04433.x
公開者
Wiley

この論文をさがす

説明

<jats:p>Although copper‐bonded alumina substrate has been used for some power electronic devices, its use has been rather limited because of lack of information on the thermally induced failure of the substrate. The phenomenology of thermal cracking was experimentally studied in this work. Interface debonding occurred at the side edge of copper chips and grew inwardly along the interface. Subsequently, the interface crack deviated into the alumina after propagating up to approximately 200 μm. The curving of the interface crack was caused by a mixed Mode I and Mode II loading near the edge. The cracking was widespread, whereby small cracks coalesced with one another to form a long, shallow crack along the perimeter of the copper chips. The cracking sensitivity was influenced by such design factors as edge sharpness, nickel plating, and copper backing. Annealing the substrate above 700 K before testing promoted the cracking considerably. The substrate cracking is discussed in terms of stress conditions near the edge.</jats:p>

収録刊行物

被引用文献 (1)*注記

もっと見る

問題の指摘

ページトップへ