書誌事項
- タイトル別名
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- Solder Shape Prediction and Residual Stress Evaluation of BGA Solder Joint.
- BGA ハンダ セツゴウブ ノ ケイジョウ ヨソク ト ザンリュウ オウリョク ヒョウカ
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説明
In this paper, prediction methods of solder joint shape, such as solder joint height and contact angle, for BGA package, which is effective on high density packaging, are studied. Various calculation methods to predict the solder joint shape are studied, and results of the calculation are compared to experimental results to confirm the validity of each calculation methods. Approximate polynomial of solder joint shape, such as solder joint height and contact angle are induced by combining numerical differential method and response surface method using orthogonal table. Next, FEM calculation of board warpage are analyzed to evaluate residual stress in solder solidification process.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 4 (7), 581-589, 2001
一般社団法人エレクトロニクス実装学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390001204561333632
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- NII論文ID
- 110001799829
- 130004062879
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- NII書誌ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL書誌ID
- 5963512
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- 本文言語コード
- ja
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- 資料種別
- journal article
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- データソース種別
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- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
- KAKEN
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用不可
