書誌事項
- タイトル別名
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- Investigation of Cu wire stitch bonding. (Report 1). Influence of bonding condition and surface state on bondability.
- Investigation on Cu wire stitch bonding (Report 1)
- 銅ワイヤステッチボンディングの接合性に関する研究(第1報)
抄録
Wire bonding is used as a method of the electrical connections between an electrode terminal on a chip of a semiconductor and an outer lead terminal. Cu wire has a good corrosion resistance and high electrical and thermal conductivity. Furthermore, Cu wire can be bonded directly to Cu alloy lead frame as a 2nd stitch bonding. For these reasons, a practical application of the Cu wire bonding process is anticipated. But, for application of Cu wire stitch bonding onto Cu alloy lead frame, there are a lot of difficult problems to be solved.<BR>In this report, the influence of the bonding conditions and surface states on the bondability of Cu wire stitch bonding is investigated. It is pointed out that the control of the wire deformation behavior is necessary for obtaining the good bondability in thermosonic Cu wire bonding. Furthermore, it is clarified that the surface state on Cu alloy lead affects on the bondability. If the maximum surface roughness on Cu alloy lead is more than 0.4 μm, or if the thickness of the oxide film on Cu alloy lead is more than 10 nm, the bondability of Cu wire stitch bonding is inferior.
収録刊行物
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- 溶接学会論文集
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溶接学会論文集 14 (1), 168-173, 1996
一般社団法人 溶接学会
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詳細情報 詳細情報について
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- CRID
- 1390001204722910464
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- NII論文ID
- 130003764502
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- COI
- 1:CAS:528:DyaK28Xit1Kntbg%3D
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- ISSN
- 24348252
- 02884771
- http://id.crossref.org/issn/02884771
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可