書誌事項
- タイトル別名
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- Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry.
抄録
Moiré interferometry technique was adopted to analyze thermal deformations of four kinds of flip-chip devices mounted on FR-4 substrate and multi-layer substrate, with and without underfill. A thermal loading was applied by heating the devices from room temperature 25°C to an elevated temperature 100°C. The experimental results showed that the underfill gave similar curvatures of silicon chip and the substrate. In the flip-chip devices mounted on the multi-layer substrate, thermal expansion coefficient mismatch between the chip and substrate was reduced, and bending deformations were decreased. The deformation of solder balls in the underfilled flip-chip device mounted on the multi-layer substrate was the least in the four kinds of flip-chip devices.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 5 (7), 654-659, 2002
一般社団法人エレクトロニクス実装学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390282679536325632
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- NII論文ID
- 130004166003
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- ISSN
- 1884121X
- 13439677
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可