携帯機器用アンダーフィル実装試験片の強度評価

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  • Strength Evaluation of Specimens Mounted with Underfill Resins in Mobile Apparatus

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The purpose of this study is development of a mounting structure to improve the strength of solder joints for portable devices. In this paper, the strengths of solder joints in chip-scale packages reinforced with various under-fill resins were determined by static-bending, cyclic-bending, impactbending, and heat-cycle tests. Joint strength during static, cyclic, and impact-bending was improved by reinforcing with resins. The lifetimes in heat-cycle tests (-40°C/85°C) were increased 1000 times or more. It was found that the shape of the resin fillets and the elastic modulus of the resin must be optimized to further increase the strength.

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