Soft Chucking in One-by-one Automatic Mirror Polishing of Silicon Wafers.
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- AKAMATSU Kiyoshi
- 正会員 (株) 日立製作所
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- FUJISAWA Masayasu
- 正会員 (株) 日立製作所
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- MASUDA Masami
- 正会員 (株) 日立製作所
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- YUI Hajime
- (株) 日立製作所
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- KASAI Toshio
- 正会員 埼玉大学工学部
Bibliographic Information
- Other Title
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- シリコンウエハの枚葉式研磨におけるソフトチャッキング技術
- シリコン ウエハ ノ マイヨウシキ ケンマ ニ オケル ソフト チャッキング
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Abstract
This paper deals with wafer chucking technology, a dominant factor in wafer flatness, in a one-by-one automatic mirror polishing process for large size silicon wafers. Rigid vacuum chucking generates wafer dimples from unexpected particles coming into the interface between wafer and chuck surfaces. Soft chucking with porous elastic film pads as chuck surfaces can prevent the generation of wafer dimples. Especially, controlling the moisture content distribution through the porous elastic film pads can achieve a good chucking accuracy to improve the wafer flatness in the chuck with a pressure detaching mechanism for automatic unloading.
Journal
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- Journal of the Japan Society for Precision Engineering
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Journal of the Japan Society for Precision Engineering 59 (1), 149-154, 1993
The Japan Society for Precision Engineering
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Details 詳細情報について
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- CRID
- 1390282679741767808
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- NII Article ID
- 110001371186
- 10003572696
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- NII Book ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
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- NDL BIB ID
- 3807698
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed