Soft bump process for LSI probing
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- Shoji Isamu
- The University of Tokyo
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- Kataoka Kenichi
- The University of Tokyo
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- Itoh Toshihiro
- The University of Tokyo
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- Suga Tadatomo
- The University of Tokyo
Bibliographic Information
- Other Title
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- LSIプロービングのためのソフトバンププロセス
Abstract
Probing at the time of LSI test is becoming difficult by the miniaturization of electrodes as LSI devices become more high-density. In conventional probing, electric contact has been achieved by breaking of aluminum oxide on the electrodes by mechanical force. This large force about 100 mN gave the damage to the device and the probe, and has caused the problem of restricting miniaturization of a probe card. In this research, a new method of contact using removable bumps on device electrodes will be proposed. In this report, a fundamental characteristic measurement of contact using the existing conductive resin material will be presented.
Journal
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- Proceedings of JSPE Semestrial Meeting
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Proceedings of JSPE Semestrial Meeting 2005S (0), 50-50, 2005
The Japan Society for Precision Engineering