Electron beam exposure Characteristic of negative electron beam resist (HSQ)
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- Yamauchi Eiki
- Department of Applied Electronics Tokyo University of Science
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- Taniguchi jyun
- Department of Applied Electronics Tokyo University of Science
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- Miyamoto iwao
- Department of Applied Electronics Tokyo University of Science
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- Ono susumu
- ELIONIX
Bibliographic Information
- Other Title
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- ネガ型電子ビームレジスト(HSQ)の電子ビーム露光特性
Description
Hydrogen Silsesquioxane (HSQ) was used as the negative electron beam (EB) resist. Tetramethyl ammonium hydroxide (TMAH) was used as developer. The characteristics of the developed height by changing exposure condition (accelerating voltage and dose) and development condition were examined. When the high concentration of TMAH was used as a developer, the developing time was shortened; moreover, nano–order patterns were obtained in low EB dose. Using HSQ and the high concentration TMAH developer, 40–nm–line width negative tone patterns were obtained. Furthermore, using this as a nanoimprint mold, 40 nm concave patterns were successfully transferred.
Journal
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- Proceedings of JSPE Semestrial Meeting
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Proceedings of JSPE Semestrial Meeting 2006S (0), 323-324, 2006
The Japan Society for Precision Engineering
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Keywords
Details 詳細情報について
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- CRID
- 1390282680630427136
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- NII Article ID
- 130005027347
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- Data Source
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- JaLC
- CiNii Articles
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- Abstract License Flag
- Disallowed