MEMSマイクロホンのダイアフラム用多結晶シリコン膜の引張強度評価

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  • Tensile Strength of Poly-Si Film for Membrane of MEMS Microphone

抄録

<p>This paper reports a quasi-static tensile test on the polysilicon thin film served as a diaphragm in MEMS microphone. The polysilicon tensile thin film samples have dimensions of 100 μm long, 10 μm wide and 0.78 or 1 μm thick and deposited using low pressure chemical vapor deposition (LPCVD) method, which is completely same as the microphone fabrication. The average tensile strength of polysilicon was around 2.3 GPa~3.8 GPa. A good agreement was observed between the tensile strength and compressive air test.</p>

収録刊行物

  • 年次大会

    年次大会 2018 (0), J2230102-, 2018

    一般社団法人 日本機械学会

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