Material Design of Insulant for High Speed Printed Circuit Board and Development of Curable Vinyl Resins.

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  • Kawabe Masanao
    Research and Development Division, Epoxy Resin Materials Center, Nippon Steel & Sumikin Chemical Co., Ltd.

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  • 次世代高速・高周波基板材料の材料設計と ビニル硬化型樹脂材料の最近の進歩
  • ジセダイ コウソク ・ コウシュウハ キバン ザイリョウ ノ ザイリョウ セッケイ ト ビニル コウカガタ ジュシ ザイリョウ ノ サイキン ノ シンポ

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Abstract

<p>High speed and large capacity of data communication and information processing are required in the highly developed ubiquitous information network society. The low dielectric loss materials (low dissipation factor and low dielectric constant) are regarded as the key to solve the difficult problem in a field of insulating materials for the high frequency data communication. In order to lower the dielectric loss, dipole moment of the high frequency materials should be lowered. From the view point of this material design, curable vinyl resins are attractive as electronic materials bearing low dielectric loss. This review introduces development of curable vinyl resins from the viewpoint of precise control of polymer structure and dielectric properties.</p>

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