Introduction of Bonding Technologies for 3D Integrations

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  • FUJINO Masahisa
    National Institute of Advanced Industrial Science and Technology (AIST)

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Other Title
  • 三次元積層のための接合技術
  • サンジゲン セキソウ ノ タメ ノ セツゴウ ギジュツ

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Description

<p>3D integration is one of the most important technologies for developing new-generation electronics devices.</p><p>In this article, bonding technologies, key factor of 3D integration are introduced. In particular, fusion bonding method and direct bonding method have the potential for wafer level bonding.</p>

Journal

  • Vacuum and Surface Science

    Vacuum and Surface Science 62 (11), 672-675, 2019-11-10

    The Japan Society of Vacuum and Surface Science

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